Design Gallery

We have many, many more examples of the work we have done and would be happy to show you not only the results but how we overcame the multitude of challenges.


PCB Design Project—Dual XM5516, Blade Processor (Telecom), Avago/LSI
This 18-layer board features two 1680-pin BGA's (XM5516) with massive vapor-tube heatsinks, four 9-chip DDR3 banks, multiple communications channels (USB, Ethernet) over a dozen 10GHz transmission lines and several hi-current switching power supplies. The 10GHz lines required extremely tight length matching (+/- 2 mils) and separation. Each of the DDR banks required significant length matching (+/- 20mils) that included the skews internal to each of the XM5516's. To maintain impedance control and circuit isolation as well as route this extremely dense design, blind vias were used extensively and the PCB was structured as essentially two 9-layer boards sandwiched together. This was undoubtedly my most challenging design.

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PCB Design Project—SPARTAN 6 LX150T DEVELOPMENT BOARD, Avnet Electronics Marketing
This 12 layer board (6-signal, 6-plane), designed from Avnet's schematics, features a Spartan 6 FPGA (BGA 676) with DDR3 memory, SFP, SATA, USB2.0, SD and RS232 interfaces, 10/100/1000 Ethernet PHY, and 2 FMC LPC Expansion slots in a PCIe X4 form factor. The challenges of this design were: 10 power rails requiring heavily split planes on the inner most layers (flanked by solid GND planes), several hi-speed interfaces requiring extensive length matching and a single-channel DDR3 memory. The unique FPGA pin-swapping and length tuning capability of Altium Designer simplified routing of this board.

For more information on this product follow this link:
Xilinx-Spartan-6-LX150t-Development-Kit

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PCB Design Project, Multi-Board—MAPPS, POWER SUPPLY/CHARGING SYSTEM (Military), Physical Optics Inc.
This 5-board assembly was designed from supplied schematics. The 2 boards on each end are simple, 4-layer interconnects. The 3 center boards are 4, 4, and 6 layers with components on both sides. The challenges for these boards were: hi-current conductors with delicate switching power supplies and the obvious mechanical constraints. All 5 boards were completed in 7 days. The 3D capabilities of Altium Designer were key to the successful completion of this project.

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Product Development Project—MINIDUCTOR II, MD700/MD800 (Automotive), Induction Innovations, Inc.
MIDS redesigned this product for Induction Innovations turning an ugly, difficult to hold and use "caulking tube" into a new, ergonomic, device. We converted a thru-hole PCB to SMT and redsigned the housing. This rather simple-looking 2-layer board posed a significant challenge due to the the nature of the circuit, a hi-voltage/current inductive-heating control system, and the necessity to fit everything inside the handle of a sleek new housing and maintain sufficient airflow to cool the circuitry. The mechcanical design was performed using ProE (Parametric Technologies). The electro-mechanical integration issues were mitigated by Altium Designer's 3D capabilitites.

For more information on this product follow this link:
www.theinductor.com/index.php?m=50&s=24



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PCB Design Project—XVPX-6300 "Archer" Embedded Processor Module (Computer Systems), Xembedded Inc.
This 18-layer board, designed from schematics supplied by Xembedded, sports an Intel I-7 (Processor), an Intel QM57 (PCH), an array of 9 DDR3 chips and several other BGAs in a '3U-VPX' form factor. The challenges were many: hi-speed interfaces requiring significant length matching, impedance control, multiple differential pairs, 2-sided parts placement and very high pin-density. Blind and buried vias were used throughout to achieve routability and meet SI criteria.

For more information on this product click here:
www.xembedded.com/content/vpx/processors/xvpc-6300.php

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PCB Design Project, Multi-board—Recon Scout "Throwbot" (Military/Law Enforcement), Recon Robotics, Inc.
The 4 boards in this project, designed from supplied schematics, all fit inside of and control a very small 'Robot' used by the police and the military for reconnaissance. The boards, 4 and 6-layer, feature video, RF and IR sensors as well as control modules to move the robot and communicate with a handheld Command Center. The design challenges were: the extreme small size and mechanical constraints as well as the variety of circuitry including digital, analog and RF.

For more information on this product click here:
www.reconrobotics.com/products/index.cfm

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PCB Design Project—Flight Processor Board (Avionics), L3 Communications-Cincinnati Electric
This 16-layer, Commercial and Military Avionics board was designed from L-3 supplied schematics. It features a SPARC processor, an Actel ProASIC FPGA, multiple memory and interface options as well as several hi-speed interfaces in a cPCI-6U form factor. The design challenges were: several hi-speed interfaces and Differential Pairs requiring length matching and impedance controlled routing and several switching power supplies. The unique FPGA pin-swapping capability of Altium Designer simplified routing of this board.

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